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Armstrong Fluid Technology: Envelope


The Envelope platform connects and optimizes mechanical system components through performance mapping, advanced analytics and lifecycle services. By creating detailed performance profiles, it enables optimal sizing and output modulation for improved efficiency. Compatible with partner products, it integrates and coordinates operations across chillers, cooling towers, boilers and heat pumps from leading manufacturers.





Contact FacilitiesNet Editorial Staff »   posted on: 2/21/2025


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